By Sachidanand Jha
•100 2nd CAD Exercises.
•50 3D CAD Exercises.
•Each workout should be designed on any CAD software program akin to AutoCAD, SolidWorks, Catia, PTC Creo Parametric, Siemens NX, Autodesk Inventor and other.
•These workouts are designed that will help you attempt out your uncomplicated CAD skills.
•Each workout should be assigned individually.
•No workout is a prerequisite for another.
Read Online or Download 150 CAD Exercises PDF
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Extra info for 150 CAD Exercises
The bulk material is actually an active part of the device structure. An extreme example of such a device is a 5-kV Thyristor which has lateral dimensions the size of one 100-mm wafer and a space charge region depth of 100 mm extending deep into the wafer. PowerMOS transistors represent another product group that depends on the bulk electrical properties. PowerMOS transistors can switch currents of some hundred amperes and some thousand volts between terminals. The current is conducted 10 P. Stallhofer through the substrate to a backside wafer contact.
N. 1007/978-1-4419-7276-7_3, # Springer Science+Business Media, LLC 2011 21 22 F. Schmitt and M. Zernack Fig. 1 Flexible 50 mm wafer Fig. 2 Fifty micrometers wafer on film frame carrier Below 150 mm thickness silicon wafers become increasingly flexible (Fig. 1). On the one hand flexibility of chips reduces the fracture strength when they are used in flexible card or board applications; on the other hand it complicates handling and subsequent manufacturing processes. The default delivery form today for wafers thinner than 150 mm is on dicing foil and film frame carrier (Fig.
Those technologies, particularly SOI substrates, will lead to much higher cost and are thus preferable for high-end applications. Evidently, all such subtractive thin chip fabrication processes lead to considerably higher cost and process effort as chip thickness decreases. A consequent step toward realising ultra-thin chips at reasonable cost is to consider additive thin chip fabrication, which offers hope for excellent chip thickness control. , features excellent thickness control by epitaxial growth and even reuse of the bulk silicon substrate (Chap.